We are the time-to-market accelerator for your ideas
Our production environment is close to series production. We offer tailor-made solutions for prototypes, small series and the development of leading-edge technologies and processes.
Our technology laboratory specialises in the manufacture of chip-on-board (CoB) solutions, thick film hybrid technology, wire bonding, encapsulation and micro-dispensing. We push the boundaries of microelectronics by testing and validating new technologies and processes.
We produce prototype parts for development departments, enabling rapid hardware validation and commissioning of newly developed circuits.
We focus on innovation and precision to deliver bespoke solutions for your most demanding projects.
Key Facts
Rapid Prototyping: Receive functional prototypes within 48 hours (subject to material availability).
Prototypes & Medium Volume Production: We offer SMT, THT and COB electronics manufacturing.
Printing & Sintering Technologies: Benefit from our expertise in thick film and hybrid technologies.
Assembly & Interconnection: We can help you develop your technologies and processes.
Material Qualification: We test and qualify new materials for your applications.
Quality Testing & Analysis: We improve the quality of your products through comprehensive testing.
Manual Assembly Tasks: Benefit from our experienced team for precise final assembly of your products.
Technology lab equipment
Clean room: 250 m² area with ISO 6 class clean room zones.
Automated screen printing system: For thick film hybrid circuits and paste printing.
Pick and place machine: For a variety of prototype and low volume requirements.
COB technology: Automated processes for adhesive dispensing, die placement, Al/Au wire bonding and glob top for prototypes, small and medium volumes.
Specialist furnaces: Ideal for glass soldering in MEMS assemblies and temperatures from 200°C to 900°C for drying, curing and sintering.
Vapour Phase Oven: For a gentle SMT soldering process.
Bonding & Encapsulation Systems: For a wide range of COB applications.
Process Ovens: For temperatures from 200°C to 900°C for drying, curing and sintering.
Application Example:
COB technology for a high-resolution WUXGA OLED microdisplay
The Fraunhofer IPMS has developed a high-resolution 1-inch WUXGA OLED microdisplay that combines optical perfection with the finest technical precision. Our high-performance COB technology and ISO-6-certified clean room production played a key role in meeting the stringent requirements for optical purity and mechanical stability.
The result is an impressive resolution of 1920 × 1200 pixels, a pixel density of 2300 ppi and an outstanding contrast ratio of over 100,000:1. This makes the microdisplay an innovation for VR/AR glasses, medical technology and other demanding applications.
